specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com, www.triquint.com page 1 of 5 july 2008 ag602-89 ingap hbt gain block product features ? dc ? 3500 mhz ? +18.5 dbm p1db at 900 mhz ? +33 dbm oip3 at 900 mhz ? 14 db gain at 900 mhz ? single voltage supply ? lead-free / rohs-compliant / green sot-89 package ? internally matched to 50 applications ? mobile infrastructure ? catv / fttx ? w-lan / ism ? rfid ? wimax / wibro product description the ag602-89 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. at 900 mhz, the ag602-89 typically provides 14 db of gain, +33 dbm oip3, and +18.5 dbm p1db. the device combines dependable performance with consistent quality to maintain mttf values exceeding 1000 years at mounting temperatures of +85 c and is housed in a lead- free/green/rohs-compliant sot-89 industry-standard smt package. the ag602-89 consists of darli ngton pair amplifiers using the high reliability ingap/ga as hbt process technology and only requires dc-blocking capacitors, a bias resistor, and an inductive rf choke for operation. the broadband mmic amplifier ca n be directly applied to various current and next ge neration wireless technologies such as gprs, gsm, cdma, and w-cdma. in addition, the ag602-89 will work for other various applications within the dc to 3.5 ghz frequency range such as catv and wimax. functional diagram rf in gnd rf out gnd 1 23 4 function pin no. input 1 output/bias 3 ground 2, 4 specifications (1) parameter units min typ max operational bandwidth mhz dc 3500 test frequency mhz 900 gain db 14.2 input return loss db 13 output return loss db 15 output p1db dbm +18.7 output ip3 (2) dbm +33.1 output ip2 dbm +47 noise figure db 4.4 test frequency mhz 1900 gain db 12.6 13.6 14.6 output p1db dbm +18.4 output ip3 (2) dbm +33.0 device voltage v 5.16 device current ma 75 1. test conditions: 25 oc, supply voltage = +6 v, r bias = 11.2 , 50 system. 2. 3oip measured with two tones at an output power of +2 dbm/tone separated by 10 mhz. the suppression on the largest im3 product is used to calculate the 3oip using a 2:1 rule. absolute maximum rating parameter rating storage temperature -55 to +150 c dc voltage +7 v rf input power (continuous) +10 dbm junction temperature +177 c thermal resistance, rth 154 c / w operation of this device above any of th ese parameters may cause permanent damage. typical performance (1) parameter units typical frequency mhz 500 900 1900 2140 s21 db 14.4 14.2 13.6 13.5 s11 db -12 -13 -16 -16 s22 db -16 -15 -14 -14 output p1db dbm +18. 6 +18.7 +18.4 +18.3 output ip3 (2) dbm +33.5 +33.1 +33.0 +33.0 noise figure db 4.3 4.4 4.5 4.5 ordering information part no. description AG602-89G ingap hbt gain block (lead-free/green/rohs-co mpliant sot-89 package) ag602-89pcb 700 ? 2400 mhz fully assembled eval. board standard t/r size = 3000 pieces on a 13? reel .
specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com, www.triquint.com page 2 of 5 july 2008 ag602-89 ingap hbt gain block typical device rf performance supply bias = +6 v, r bias = 11.2 , i cc = 75 ma frequency mhz 100 500 900 1900 2140 2400 3500 5800 s21 db 14.5 14.4 14.2 13.6 13.5 13.2 12.2 9.6 s11 db -12 -12 -13 -16 -16 -17 -13 -10 s22 db -18 -16 -15 -14 -14 -13 -10 -7 output p1db dbm +18.6 +18.6 + 18.7 +18.4 +18.3 +18.3 +17.5 output ip3 dbm +33.8 +33.5 +33.1 +33.0 +33.0 +33.0 noise figure db 4.3 4.3 4.4 4.5 4.5 4.6 1. test conditions: t = 25 oc, supply voltage = +6 v, device voltage = 5.16 v, rbias = 11.2 , icc = 75 ma typical, 50 system. 2. 3oip measured with two tones at an output power of +2 db m/tone separated by 10 mhz. the suppression on the largest im3 prod uct is used to calculate the 3oip using a 2:1 rule. 3. data is shown as device performance only. actual implementation for the desired frequency band will be determined by exter nal components shown in the application circuit. gain vs. frequency 6 8 10 12 14 16 01234 frequency (ghz) gain ( db ) -40 c +25 c +85 c return loss -40 -30 -20 -10 0 0123456 frequency (ghz) s11, s22 ( db ) s11 s22 i-v curve 0 20 40 60 80 100 120 3.4 3.8 4.2 4.6 5.0 5.4 5.8 device voltage (v) device current ( ma ) optimal operating poin t output ip3 vs. frequency 20 25 30 35 40 00.511.522.53 frequency (ghz) oip3 ( dbm ) -40 c +25 c +85 c output ip2 vs. frequency 30 35 40 45 50 0 200 400 600 800 1000 frequency (mhz) oip2 ( dbm ) -40 c +25 c +85 c noise figure vs. frequency 1 2 3 4 5 6 0 0.5 1 1.5 2 2.5 3 frequency (ghz) nf ( db ) -40 c +25 c +85 c p1db vs. frequency 0 5 10 15 20 00.511.522.533.54 frequency (ghz) p1db ( dbm ) -40 c +25 c +85 c output power / gain vs. input power frequency = 900 mhz 10 11 12 13 14 15 -12 -8 -4 0 4 8 input power (dbm) gain ( db ) 0 4 8 12 16 20 out p ut power ( dbm ) output power gain output power / gain vs. input power frequency = 2000 mhz 4 6 8 10 12 14 -12 -8 -4 0 4 8 input power (dbm) gain ( db ) 0 4 8 12 16 20 out p ut power ( dbm ) output power gain
specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com, www.triquint.com page 3 of 5 july 2008 ag602-89 ingap hbt gain block typical device rf performance (cont?d) supply bias = +8 v, r bias = 38 , i cc = 75 ma gain vs. frequency 6 8 10 12 14 16 01234 frequency (ghz) gain ( db ) -40 c +25 c +85 c output ip3 vs. frequency 20 25 30 35 40 00.511.522.53 frequency (ghz) oip3 ( dbm ) -40 c +25 c +85 c output ip2 vs. frequency 30 35 40 45 50 0 200 400 600 800 1000 frequency (mhz) oip2 ( dbm ) -40 c +25 c +85 c p1db vs. frequency 0 5 10 15 20 00.511.522.533.54 frequency (ghz) p1db ( dbm ) -40 c +25 c +85 c noise figure vs. frequency 1 2 3 4 5 6 0 0.5 1 1.5 2 2.5 3 frequency (ghz) nf ( db ) -40 c +25 c +85 c
specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com, www.triquint.com page 4 of 5 july 2008 ag602-89 ingap hbt gain block application circuit recommended component values reference frequency (mhz) designator 50 500 900 1900 2200 2500 3500 l1 820 nh 220 nh 68 nh 27 nh 22 nh 18 nh 15 nh c1, c2, c4 .018 f 1000 pf 100 pf 68 pf 68 pf 56 pf 39 pf 1. the proper values for the components are dependent upon the intended frequency of operation. 2. the following values are contained on the evaluation board to achieve optimal broadband performance: ref. desig. value / type size l1 39 nh wirewound inductor 0603 c1, c2 56 pf chip capacitor 0603 c3 0.018 f chip capacitor 0603 c4 do not place r1 10.0 1% tolerance 0805 recommended bias resistor values supply vol tage r1 val ue s i z e 6 v 11.2 ohms 0805 7 v 24.5 ohms 1210 8 v 38 ohms 1210 9 v 51 ohms 2010 10 v 65 ohms 2010 12 v 91 ohms 2512 the proper value for r1 is dependent upon the supply voltage and allows for bias stability over temperature. wj recommends a minimum supply bias of +6 v. a 1% tolerance resistor is recommended. typical device data s-parameters (v device = +5.16 v, i cc = 75 ma, t = 25 c, calibrated to device leads) freq (mhz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang) s22 (db) s22 (ang) 50 -12.45 -179.91 14.65 177.68 -18.47 0.30 -18.85 -178.44 250 -12.80 173.14 14.64 168.81 -18.89 -0.92 -18.64 -178.50 500 -11.98 161.40 14.50 157.67 -18.95 -8.53 -16.31 -178.33 750 -12.30 151.47 14.40 146.73 -18.97 -11.88 -16.00 -176.91 1000 -13.15 140.39 14.28 136.05 -19.19 -19.66 -15.76 -176.74 1250 -13.66 132.83 14.17 125.29 -18.81 -22.16 -15.26 -175.58 1500 -14.64 123.63 14.01 114.91 -18.86 -24.27 -15.11 -174.90 1750 -15.97 112.75 13.85 104.18 -18.94 -28.63 -14.80 -175.62 2000 -17.11 96.84 13.66 93.65 -18.68 -33.27 -14.28 -177.69 2250 -16.83 69.35 13.46 83.50 -18.54 -37.00 -13.75 -168.13 2500 -17.16 59.34 13.32 75.95 -19.15 -44.64 -13.33 -178.03 2750 -16.62 55.01 13.10 65.23 -18.55 -48.27 -13.21 168.67 3000 -15.52 52.50 12.84 54.89 -18.59 -51.43 -12.58 151.61 3250 -14.36 50.49 12.59 44.74 -18.62 -55.38 -11.68 133.62 3500 -12.98 48.86 12.26 34.37 -18.77 -61.67 -10.45 117.29 3750 -11.45 46.31 11.88 24.22 -18.67 -67.58 -9.21 103.08 4000 -10.56 43.88 11.51 14.12 -18.75 -72.12 -8.31 91.70 4250 -9.85 41.17 11.18 4.58 -18.49 -77.01 -7.57 81.65 4500 -9.57 37.68 10.85 -5.08 -18.56 -82.75 -7.25 72.53 4750 -9.72 34.04 10.64 -15.21 -18.35 -87.23 -7.09 64.42 5000 -9.99 28.26 10.44 -25.10 -18.54 -92.28 -7.07 56.77 5250 -10.47 20.24 10.28 -35.32 -18.23 -100.76 -7.28 47.25 5500 -10.65 10.13 10.00 -46.33 -17.94 -107.33 -7.18 37.35 5750 -10.11 -0.98 9.79 -57.68 -17.99 -114.40 -6.88 24.19 6000 -8.96 -13.41 9.41 -69.50 -18.15 -123.08 -6.18 10.75 device s-parameters are available for download off of the website at: http://www.wj.com c1 blocking capacitor rf out l1 rf choke c3 0.018 f r1 bias resisto r rf in c4 bypass capacito r c2 blocking ca p acito r vcc icc = 75 m a a g602-89
specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com, www.triquint.com page 5 of 5 july 2008 ag602-89 ingap hbt gain block AG602-89G (green / lead-free sot-89 package) mechanical information this package is lead-free/green/ro hs-compliant. it is compatible with both lead- free (maximum 260 c reflow temperature) and leaded (maximum 245 c reflow temperature) soldering processes. the plating material on the leads is nipdau. outline drawing land pattern product marking the AG602-89G will be marked with an ?a602g? designator with an alphanumeric lot code marked below the part designator. the obsolete tin-lead package is marked with an ?ag602? designator followed by an alphanumeric lot code. tape and reel specifications for this part are located on the website in the ?application notes? section. msl / esd rating esd rating: class 1c value: passes 1000v min. test: human body model (hbm) standard: jedec standard jesd22-a114 esd rating: class iv value: passes 1000v min. test: charged device model (cdm) standard: jedec standard jesd22-c101 msl rating: level 3 at +260 c convection reflow standard: jedec standard j-std-020 mounting config. notes 1. ground / thermal vias are critical for the proper performance of this device. vias should use a .35mm (#80 / .0135?) diameter drill and have a final plated thru diameter of .25 mm (.010?). 2. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. mounting screws can be added near the part to fasten the board to a heatsink. ensure that the ground / thermal via region contacts the heatsink. 4. do not put solder mask on the backside of the pc board in the region where the board contacts the heatsink. 5. rf trace width depends upon the pc board material and construction. 6. use 1 oz. copper minimum. 7. all dimensions are in millimeters (inches). angles are in degrees. a602g xxxx-x
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